Mechanical Engineering Faculty Publishes Research Paper in SCI Indexed Journal
Prof. Ramakrishna Devananda, Dept. of Mechanical Engineering published a research paper titled “Thermal interface materials for cooling microelectronics systems: present status and future challenges” in the Journal of Materials Science: Materials in Electronics.
The paper has been co-authored by Prof. Narayan Prabhu, HoD, Dept. of Metallurgical and Materials Engineering, NITK, Surathkal.
About Journal of Materials Science: Materials in Electronics
The journal’s publisher is Springer. The journal has an impact factor of 2.2 and is abstracted and indexed in SCI, Scopus, Japanese Science and Technology Agency, SCImago. CAS, INSPEC and UGC-CARE List. The journal comes under Q2 of the quartile category with an H-Index of 67.
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